|
|
|
My Skills
-
Knowledge of Silicon,
Silicon Carbide (SiC) and MEMS technology
-
Thermal oxidation, Diffusion, Ion implantation, Photolithography, LPCVD, PECVD, APCVD, Thermal annealing, Reactive Ion Etching, Anisotropic etching using KOH/TMAH, Metallization, Wire Bonding, Packaging and Characterization
- Layout Design, Simulation and modeling
-
Design/Simulation Tools : SILVACO (Atlas, Athena), L-Edit and ANSYS
Computational Tools : LabVIEW, Origin
Language : C, C++ (Limited Exposure)
-
Handling capability of
scientific equipments and systems
·
Varian’s e-Beam evaporation unit
·
Thermco’s Oxidation furnace
·
MA-56 Mask aligner and spin coater
·
Talyer Hobson’s Talytstep
·
West Bond’s ball to wedge wire bonder
·
Keithely’s 236 and 238 source meter unit
·
Agilent 4284A LCR meter and HP 4140B pA meter/DC voltage source
|
|
